Single-wire cutting machine

SOMOS single-wire machines slice into wafers hard materials such as SiC or sapphire.

The material to be cut is glued to a sacrificial support; the diamond wire, which is continuously wound and unwound, removes material at the set rate.

The machine is controlled by a PLC. The human-machine interface is easy and intuitive to use.

SOMOS single-wire machines are ideal for cutting hard and ultra-hard materials, such as silicon, silicon carbide, quartz, sapphire, graphite, ruby and natural stones.

NCS and NCX are equipped with wire breakage detection systems, to automatically stop the machine in the event of a breakage.

Wire tension and speed can be adjusted to suit the material to be cut.

The use of this type of technology reduces material losses compared to standard/conventional slicing methods.